FPC Prototype in Humanized Way

Quick FPC, Rigid-flex PCB prototype and PCB Assembly

Flex PCB Capability
Flex PCB Capability
Rigid-Flex PCB Capability
Rigid PCB Capability
Flex PCB Manufacture Process
Our Flex PCB Factory
FPC Layers Stack Up
PCB Assembly Capability
Standard PCB Assembly Capability
Files Required for PCB Assembly
PCB Assembly Process
Our PCB Assembly Factory


 

FPCway is a professional flex PCB and flex-rigid PCB manufacturer from prototype to production in Shenzhen China since 2013. Our FPC and rigid-flex PCB boards have been highly used in Medical, Consumer Products, IOT, Industries, Wearables and Automative, etc.

 

The following is our flexible PCB capabilities for your reference.

 

Flex PCB Technical Capabilities

FPC Layer

NO.ITEMStandard CapabilitiesSpecial Capabilities
1FPC Layer1-12L1-16L

FPC Material

2Base MaterialPI (12.5um, 25um, 50um)100um
3Copper TypeRA Copper:  12um, 18um, 35um, 70um

ED Copper:  12um, 18um, 35um, 70um
6um, 9um, 100um
4PI Coverlay12.5um, 25um, 50um100um
5AdhesivePSA Adhesive: 50um-100um (3M467, Tesa 8853, Tesa 8854, etc.) 
6Hot-Press Adhesive: 13um, 25um 
7StiffenersPI Stiffener: 12.5/25/50/75/100/125/150/200/250 (um) 
PET Stiffener: 0.125/0.188/0.25(mm) 
FR4 Stiffener: 0.1mm-2.0mm2mm
SUS Stiffener: 0.1mm-0.6mm 
Aluminum Stiffener: 0.2mm-2.0mm 
8EMI shielding filmHCF-6000G, PC800, etc.100um

Board Size & Thickness

9Biggest Board Size500mm*600mm 
10Longest Board Size250mm*2520mm 
11Biggest Board Thickness2.0mm 
12Thinnest Board Thickness0.05mm 
13Thickness Tolerance0.05mm~0.24mm: ±0.03mm
0.25mm~0.47mm: ±0.05mm
 

Drill

14Minimum Hole Size0.1 mm0.025mm
15Holes Size Tolerance±0.05 mm 
16Holes Posistion Tolerance±0.05 mm 
17Minimum vias Pad Size0.3mm0.2mm
18Minimum Annular Ring Size0.1mm0.075mm
19Blind/Buried ViasYes 

Copper Tracks and Plating

20Minimum Track Width/Space (70um Copper)0.15mm/0.2mm0.1mm/0.15mm
21Minimum Track Width/Space (35um Copper)0.1mm/0.1mm0.075mm/0.075mm
22Minimum Track Width/Space (18um Copper)0.07mm/0.07mm0.05mm/0.05mm
23Minimum Track Width/Space (12um Copper)0.04mm/0.04mm0.035mm/0.035mm
24Track Width Tolerance20%0.02mm
25Tracks/Pads Position Tolerance≥0.06 mm≥0.05 mm
26Tracks/Pads To Board Edge≥0.15 mm≥0.05 mm
27Golden Finger Pitch TolerancePitch:10~20mm : ± 0.03mm,
Pitch:20~50mm : ± 0.05mm
 
28Copper Plating Thickness8-20um 
29Hole Copper Thickness8-20um35um
30Minimum Copper Thickness for Hollow Out FPC35um 

Surface Finish

31ENIGAU: 1-2u" Thickness
NI: 40-120u" Thickness
 3u” Thickness
32Electrolytic Nickel Gold
(Hard Gold Plating)
AU: 1-50u” Thickness
NI: 80-320u" Thickness
 
33Immersion Silver Ag: 6-12u" Thickness 
34OSP 8-16u" Thickness 
35Immersion Tin SN: 10-60u" Thickness 
356Tin Plating SN: 5-30um Thickness 
37ENEPIGAu:1-4u" Thickness
NI: 120-200u" Thickness
Pd:1-6u" Thickness
 

Coverlay

38Coverlay Opening Size Tolerance±0.1 mm±0.03 mm
39Minimum Drilling Size on Coverlay Opening0.45mm0.2mm
40Minimum Square Size on Coverlay Opening0.7mm*0.7mm0.2mm*0.2mm
41Coverlay Opening Position Tolerance±0.1 mm±0.03 mm
42Coverlay Align Tolerance±0.1 mm±0.02 mm
43Excessive Glue≤0.15 mm 
44Minimum Area of Excessive Glue≤20% Pads Area 

Solder Mask and Silkscreen

45Solder Mask Thickness15um +/-5um 
46Solder Mask Tolerance For Opening Size+/-0.05mm+/-0.02mm
47Solder Mask Tolerance For Opening Position0.1mm+/-0.02mm
48Minimum Silkscreen line width0.13mm 
49Minimum Silkscreen Gap0.2mm 
50Minimum Silkscreen Position Tolerance+/-0.3mm 
51Minimum Silkscreen height0.8mm 
52Minimum Solder Mask Bridge0.13mm 

Board Outline & Stiffeners

53Board Outline Tolerance
with Steel Die
±0.1 mm±0.03mm 
54Board Outline Tolerance
with Knife Die
±0.2 mm 
55Minimum Gap Between Drilling and Board Edge≥0.5 mm 
56PSA Position Tolerance±0.2 mm 
57Stiffeners Position Tolerance±0.2 mm 

FPC E-Test

58Test Voltage10-50V 
59Insulation Test Impedance≥10MΩ 
60Conduction Test Impedance≤50Ω 
61Impedance Tolerance10% 

FPC Physical Property

62Solderability Test245±5℃, 3 Seconds For One Time,
Soldering Area≥95% 
 
63Thermal Shock Test288±5℃, 10 Seconds Per 3 Times,
No Delamination and No Bubbles
 
64FCCL Peel Strength≥0.8kgf/㎠  (1cm width sample) 
65Coverlay Peel Strength≥0.8kgf/㎠  (1cm width sample) 
66Stiffeners Peel Strength 0.15 N/mm (Hot-Press Adhesive)
0.49 N/mm (PSA Adhesive)
 

 

Contact us

  • Email: sales@fpcway.com
  • Tel: 086 18576671093
  • Skype: Downey_PCB-PCBA
  • Address: No.12, Shapuwei Industrial Road
  • Songgang Street, Baoan District, Shenzhen

About us

  • Based in Shenzhen China, FPCway is professional at Flex PCB,
    Rigid-flex PCB and PCB assembly services
  • Flex PCB compliant ISO9001, ISO14001, TS16949, UL, RoHS.
    PCB Assembly compliant ISO9001, IATF16949, IPC-A-610E.
  • Our aim is "Humanized way to make Flex PCB". Choose us,
    you will have the best flex PCB and assembly partner.

Certifications

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