FPC Prototype in Humanized Way

Quick FPC, Rigid-flex PCB prototype and PCB Assembly

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FPCway: Specialized manufacturer of flexible printed circuit boards and rigid-flexible printed circuits
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Flex PCB Polyimide Coverlay and Solder Mask
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Introduction of Flexible PCB
5 Tips For Designing Flexible PCB
Advantages of FPC (Flexible PCB)
Evolution of the Flex Printed Circuit Board
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Why Rigid-Flex PCBs are Economical?
Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
Development Trend of FPC Board
Flex PCB and the Manufacturing
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How to Ensure Flex PCB Design Success
How to Select the Appropriate FPC Materials?
The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
Flex-Rigid PCB Design Guidelines
Beneficials for Polyimide Flex PCB Boards
About Stiffener on Flex PCB FPC circuit Boards
PCB Surface Finish Comparison
Copper Thickness for FPC Boards
Interconnect Solutions for Flexible Printed Circuits and Etched Foil Heaters
Advantages and Disadvantages of Rigid-Flex PCB
About FPC Plating Process
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PCB Assembly Blog
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
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Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly
About SMT (Surface Mount Technology)


When you visit a PCBA Manufacturer in China you may ask the engineer or the engineer will tell you why the component would have needed to be baked before reflow soldering. 


In general, the reason for baking a component is to carefully remove all the moisture from the plastic part of the component. When a SMT component goes through a reflow oven, the temperature of the component (obviously) rises very quickly, causing any moisture inside to turn into steam. If without process of baking, it may lead some problems during inspection such as cold soldering. 


When we need to bake the component?


1. No need bake if component with sealed vacuum bags. 


2. If the relative humidity level is over 20% showed on humidity indicator when open the bags then component require baking. 


3. If the component exposed over 72 hours (bag opened) before reflow soldering then component require baking. 


4. If the component packed with other kind bags but not vacuum bags and without humidity indicator then component require baking. 


5. The recommended bake humidity for component in is 10%, the recommended bake time is 48 hours. 




1. The lifespan of component is 12 months under sealed vacuum bags. 


2. After opening the bag, in conditions of 30℃ & 60%RH, the component need bake before reflow soldering if based on below situation (see table)


IPC/JEDEC J-STD-20 provides Moisture Sensitivity Level


MSL 6 – Mandatory Bake before use 

MSL 5A – 24 hours 

MSL 5 – 48 hours

MSL 4 – 72 hours

MSL 3 – 168 hours

MSL 2A – 4 weeks 

MSL 2 – 1 year 

MSL 1 – Unlimited


3. If the sealed bags opened however no need production at that moment then the component need to be stored in the drying oven instantly (in conditions relative humidity below 20%).

Contact us

  • Email: sales@fpcway.com
  • Tel: 086 18576671093
  • Skype: Downey.Jin_PCB&PCBA
  • Address: No.12, Shapuwei Industrial Road
  • Songgang Street, Baoan District, Shenzhen

About us

  • Based in Shenzhen China, FPCway is professional at Flex PCB,
    Rigid-flex PCB and PCB assembly services
  • Flex PCB compliant ISO9001, ISO14001, TS16949, UL, RoHS.
    PCB Assembly compliant ISO9001, IATF16949, IPC-A-610E.
  • Our aim is "Humanized way to make Flex PCB". Choose us,
    you will have the best flex PCB and assembly partner.


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