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Quick FPC, Rigid-flex PCB prototype and PCB Assembly

Flex PCB Blog
Future Trends of Flexible Circuit Boards
Rigid-Flex PCB Stack-up for Impedance Controlled Designs
Control Impedance Between Rigid PCB and Flex PCB
Flex PCB Reliability and Bendability
Normal Flex PCB Specifications
Flex PCB Polyimide Coverlay and Solder Mask
Flex PCB Boards and Connectors
About RA Copper and ED Copper
Introduction of Flexible PCB
5 Tips For Designing Flexible PCB
Advantages of FPC (Flexible PCB)
Evolution of the Flex Printed Circuit Board
Benefits of Using Flex Circuit Boards
Why Rigid-Flex PCBs are Economical?
Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
Development Trend of FPC Board
Flex PCB and the Manufacturing
About Flex PCB design
About Flex PCB and Assembly
How to Ensure Flex PCB Design Success
How to Select the Appropriate FPC Materials?
The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
Flex-Rigid PCB Design Guidelines
Beneficials for Polyimide Flex PCB Boards
About Stiffener on Flex PCB FPC circuit Boards
PCB Surface Finish Comparison
Copper Thickness for FPC Boards
Interconnect Solutions for Flexible Printed Circuits and Etched Foil Heaters
Advantages and Disadvantages of Rigid-Flex PCB
About FPC Plating Process
About EMI shield design for Flex Printed Circuit Board
PCB Assembly Blog
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly
About SMT (Surface Mount Technology)

The most frequently asked question we receive regarding flex circuits is “how much can I bend a flex?” 


The standard IPC answer is 10 times the thickness of the material. There is a section in IPC-2223 that offers reasonable information on bend radius calculations. But there are other factors that need consider when designing a flex circuit for high reliability. 


1. Grain direction in the copper is important for tight bend radii.


2. The stiffness of a flex is primarily driven by the copper weight but kapton thickness is also critical.


3. Where is the bend located? 


Here are some other thoughts of how to increase reliability for a flex circuit application. 




1. Reduce the base copper weight (and the corresponding adhesive thicknesses) or reduce the dielectric thickness. 


2. Use adhesiveless base materials. Adhesiveless materials will usually reduce the starting thickness of each substrate by 12-25um (0.0005”- 0.0010”) when compared to adhesive based substrates. 


3. Eliminate copper plating on the conductors in the flexing area (dynamic region) by utilizing selective (pads plating/button plating-only) allowing the circuit to have increased flexibility. 




1. Conductors should be staggered from layer to layer and not stacked on top of each other to increase flexibility. 


2. Conductor thickness and width should remain constant in bending areas. 


3. Balance the conductor weights and material thicknesses on each side of the neutral bend axis. 


4. Bend radius of a flex should be approximately 10 times the material thickness and at least 500um (0.020”) away from the plated through hole. 


5. Incorporate tear stops or reliefs for slits in the circuit. The end of the slit represents a vulnerable point for a tear to start and to propagate.

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  • Based in Shenzhen China, FPCway is professional at Flex PCB,
    Rigid-flex PCB and PCB assembly services
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